Electronics Forum: components and edge and stress (Page 1 of 4)

The minimal distance btw component and the edge of pcb

Electronics Forum | Sun Oct 09 16:57:30 EDT 2016 | davef

IPC 2222A Sectional Design Standard for Rigid Organic Printed Boards, 5.3 Design Requirements for Printed Board Assembly

The minimal distance btw component and the edge of pcb

Electronics Forum | Sat Nov 05 20:23:11 EDT 2016 | sarason

Close but not to close, would have to be the spec. Or depends on your separating technology. Prerouted boards on a panel, you could go right up to the edge. V-grove you will need more distance, maybe 2mm's or more. The distance from the panel edge to

The minimal distance btw component and the edge of pcb

Electronics Forum | Tue Nov 01 12:28:36 EDT 2016 | comatose

It depends. Are you hand breaking them, rotary knife or linear knife? Hand break you want to be about 5mm (and it isn't a great practice even then) with a rotart knife you want to keep parts probably 3mm, especially capacitors. With a linear knife we

Laying down and holding large components

Electronics Forum | Thu May 22 18:47:12 EDT 2003 | russ

I would assume we are talking about a radial leaded electrolytic cap? We use Electronic grade RTV (Dow corning 3145). It sticks good and can be removed if necessary. It is also pliable so you don't have to worry about CTE or other stresses that may

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

Need opinions on equipment for picking and placing truly odd types of components

Electronics Forum | Tue Mar 12 09:56:50 EDT 2013 | emeto

Hi, I don't know what you mean by really odd parts. Are they SMT parts that have a flat surface to pick them up? If so, probably several machines can do it. I know for sure Siemens can place almost anything. THey will help you with any type of nozzl

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

tape and reel machine

Electronics Forum | Wed Oct 10 13:35:00 EDT 2001 | stepheno

I used to work with Chris. (neither of us are there anymore). What is he talking about is putting components into "pockets". The parts would come in, in sticks (tubes) but we wanted them in reels. At first we sent them out to be reeled, but that w

Circuit cam and mydata

Electronics Forum | Wed Mar 25 18:34:34 EDT 2020 | spoiltforchoice

> What about designators? Using gerbers to program > a pnp machine was always a last resort to be done > only after much complaining and begging for > proper CAD data. Back in the day I used UniCAM to > program a mydata. After gett

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar


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